“In the current telecom doldrums, most mobile network operators are faced with the pressure of uncertain ROI due to high cost of 3G investments. However, the OSA/Parlay platform could potentially offer a new paradigm for innovative services that can boost ARPU for the operators.
After all, 3G is about speed and services”
~ Lee Sze Chin, Associate Consultant, Enabler Technologies, IDA


Announcing the premier Mobile Open Services Architecture (OSA) Forum scheduled in Singapore from 23-25 April 2003 supported by IDA.



The primary objective of the event is to provide the latest briefing and discussion on

·OSA/Parlay specifications and standard updates

·Business case for telecom operators to define and promote an open application platform for value added services

·Technological developments of Parlay and 3GPP OSA

·OSA/Parlay-based applications for service development and products

·Trials and Case Studies

本届论坛将于4月23－25日在新加坡举办。如果您对此感兴趣或有意参加，请联系8610-64686747或xz_jia@ppa.com.tw获取详细资料。